To fully digitize the last mile of business, you need to distribute compute power where it’s needed most — right next to IoT devices that collect data from the real world.
The interior of the Earth is a mystery, especially at greater depths (660 km). Researchers only have seismic tomographic images of this region and, to interpret them, they need to calculate seismic (acoustic) velocities in minerals at high pressures and temperatures. With those calculations, they can create 3D velocity maps and figure out the mineralogy and temperature of the observed regions. When a phase transition occurs in a mineral, such as a crystal structure change under pressure, scientists observe a velocity change, usually a sharp seismic velocity discontinuity.
In 2,003 scientists observed in a lab a novel type of phase change in minerals—a spin change in iron in ferropericlase, the second most abundant component of the Earth’s lower mantle. A spin change, or spin crossover, can happen in minerals like ferropericlase under an external stimulus, such as pressure or temperature. Over the next few years, experimental and theoretical groups confirmed this phase change in both ferropericlase and bridgmanite, the most abundant phase of the lower mantle. But no one was quite sure why or where this was happening.
In 2,006 Columbia Engineering Professor Renata Wentzcovitch published her first paper on ferropericlase, providing a theory for the spin crossover in this mineral. Her theory suggested it happened across a thousand kilometers in the lower mantle. Since then, Wentzcovitch, who is a professor in the applied physics and applied mathematics department, earth and environmental sciences, and Lamont-Doherty Earth Observatory at Columbia University, has published 13 papers with her group on this topic, investigating velocities in every possible situation of the spin crossover in ferropericlase and bridgmanite, and predicting properties of these minerals throughout this crossover. In 2,014 Wenzcovitch, whose research focuses on computational quantum mechanical studies of materials at extreme conditions, in particular planetary materials predicted how this spin change phenomenon could be detected in seismic tomographic images, but seismologists still could not see it.
How feasible is it to build a Jupiter brain, a computer the size of a planet? Just in the past few decades, the amount of computational power that’s available to humanity has increased dramatically. Your smartphone is millions of times more powerful than the NASA computers used to send astronauts to the moon on the Apollo 11 mission in 1969. Computers have become integral to our lives, becoming the backbone of our communications, finances, education, art, health care, military, and entertainment. In fact, it would be hard to find an area of our lives that computers didn’t affect.
Now imagine that one day we make a computer that’s the size of an entire planet. And we’re not talking Earth, but larger, a megastructure the size of a gas giant like Jupiter. What would be the implications for humans to operate a computer that size, with an absolutely enormous, virtually limitless, amount of computing power? How would our lives change? One certainly begins to conjure up the transformational effects of having so much oomph, from energy generation to space travel and colonization to a fundamental change in the lifespan and abilities of future humans.
Continue reading “How to Make a Jupiter Brain — A Computer the Size of a Planet” »
Creating Smart Home Ecosystems — Enabling Health & Well-Being In Every Home — Viren Shah, VP & Chief Digital Officer, GE Appliances, Haier
Mr. Viren Shah is Vice President & Chief Digital Officer, at GE Appliances (GEA — https://www.geappliances.com/), the American home appliance manufacturer, now a majority owned subsidiary of the Chinese multinational home appliances company, Haier (https://www.haierappliances.com/).
The Loihi 2 chip doesn’t just significantly boost the number of neurons from its first iteration, it also greatly expands their functionality.
https://youtube.com/watch?v=YYgG2a-_2po
We all know glass comes from sand but we don’t always get to see this process in action. In this video, we bring you footage of a solar-powered 3D printer that makes glass sculptures out of sand. Impressed? Just wait till you see the clips.
The 3D printer is called Solar Sinter and it was built by Markus Kayser. It works in the following way: after computer-drawn models are loaded into the machine, a large Fresnel lens beams sunlight onto a sandbox which leads to high temperatures of 2,552–2,912 F (1,400–1,600 C).
Continue reading “This Solar-Powered 3D Printer Turns Sand into Glass Sculptures” »
DETROIT — General Motors on Friday said it expects to reopen the remaining three North American assembly plants that have been idled because of the global microchip shortage by Nov. 1.
GM also said it plans to resume building Chevrolet Malibu sedans for the first time in nearly nine months at a plant that has partially reopened in Kansas.
The automaker said its plant in Ramos Arizpe, Mexico, which has been shut since mid-August, would start building Chevy Blazers on Oct. 18 followed by Chevy Equinoxes as soon as Nov. 1.
The semiconductor shortage has curtailed the choices available to designers and caused some inventive solutions to be found, but the one used by [djzc] is probably the most inventive we’ve yet seen. The footprint trap, when a board is designed for one footprint but shortages mean the part is only available in another, has caught out many an engineer this year. In this case an FTDI chip had been designed with a PCB footprint for a QFN package when the only chip to be found was a QFP from a breakout board.
For those unfamiliar with semiconductor packaging, a QFN and QFP share a very similar epoxy package, but the QFN has its pins on the underside flush with the epoxy and the QFP has them splayed out sideways. A QFP is relatively straightforward to hand-solder so it’s likely we’ll have seen more of them than QFNs on these pages.
There is no chance for a QFP to be soldered directly to a QFN footprint, so what’s to be done? The solution is an extremely inventive one, a two-PCB sandwich bridging the two. A lower PCB is made of thick material and mirrors the QFN footprint above the level of the surrounding components, while the upper one has the QFN on its lower side and a QFP on its upper. When they are joined together they form an inverted top-hat structure with a QFN footprint below and a QFP footprint on top. Difficult to solder in place, but the result is a QFP footprint to which the chip can be attached. We like it, it’s much more elegant than elite dead-bug soldering!
Taiwan’s TSMC and Japan’s Sony Group Corp are considering jointly building a chip factory in Japan, with the government ready to pay for some of the investment of about 800 billion yen ($7.15 billion), the Nikkei reported on Friday, October 8 2021. (
WORLD’S LARGEST CHIPMAKER TO RAISE PRICES, THREATENING COSTLIER ELECTRONICS
Both Sony and TSMC declined to comment. But TSMC, the world’s largest contract chipmaker and major Apple Inc supplier had said in July that it was reviewing a plan to set up production in Japan.
